Ballistic missile 9M723K5 "Iskander-M"
Memory chip XCF02S
78736
225 VS
Ballistic missile 9M723K5 "Iskander-M"
Flight data processing unit (BOPI) from the 9B918 BINS system
Printed circuit board 468157.012 20 0984 04.22
Memory chip
XCF02S
78736
225 VS
Name and marking
Memory chip
XCF02S
78736
225 VS
78736
225 VS
Manufacturer's headquarters country
United States of America
Manufacturer
Xilinx Inc. (AMD)
Extended description
Production date
25th week (June) of 2022
Additional information
Publication date
27.08.2026
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