Ballistic missile 9M723K5 "Iskander-M"
Memory chip 25Q64FVS1G
2205
Ballistic missile 9M723K5 "Iskander-M"
Flight data processing unit (BOPI) from the 9B918 BINS system
Printed circuit board 3092 07.25
Memory chip
25Q64FVS1G
2205
Name and marking
Memory chip
25Q64FVS1G
2205
2205
Manufacturer's headquarters country
Taiwan
Manufacturer
Winbond Electronics Corporation
Extended description
Production date
5th week (February) 2022
Additional information
Publication date
27.08.2026
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