Ballistic missile 9M723-1 "Iskander-M"
SPI FLASH BIOS memory chip winbond
2SQ64FVSIG
2207
Ballistic missile 9M723-1 "Iskander-M"
Unit 9B918
Board 467444.006 (form factor: PC/104)
SPI FLASH BIOS memory chip
winbond
2SQ64FVSIG
2207
Name and marking
SPI FLASH BIOS memory chip
winbond
2SQ64FVSIG
2207
2SQ64FVSIG
2207
Manufacturer's headquarters country
Taiwan
Manufacturer
Winbond Electronics Corporation
Extended description
Production date
February (7th week) 2022
Additional information
Publication date
01.06.2024
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